Advanced Packaging of Dishan Technology: Empowering Chip Performance to Leap Forward and Building a New Engine for Domestic Semiconductors
Overview
The technological evolution of the semiconductor industry is moving from "process miniaturization" to a new era of "system integration". Advanced packaging, as a key hub connecting chip design and system performance, has become the core path to improve overall chip performance, reduce power consumption, and shrink size. Dishan Technology closely follows the global semiconductor technology trend, actively layouts advanced packaging technology, and deeply integrates it into the research and manufacturing system of sensor chips. This not only significantly improves the integration and reliability of products, but also opens up a new track for the independent controllability of domestic high-end chips. Through continuous technological innovation and industry collaboration, Dishan Technology is using advanced packaging as the "core" engine to promote the leapfrog development of China's semiconductor industry in global competition.
Traditional packaging mainly undertakes chip protection and electrical connection functions, while advanced packaging achieves faster, more compact, and lower power interconnection between chips through innovative processes such as 3D stacking, heterogeneous integration, and wafer level packaging. Essentially, it is a manifestation of "System in Package" (SiP) and "Chip Systematization". Di Shan Technology deeply understands that the performance of sensor chips depends not only on design and manufacturing, but also on the comprehensive optimization of signal integrity, thermal management, and mechanical stability in the packaging process. For example, in the field of intelligent vehicles, ADAS systems have extremely strict requirements for high response speed and anti-interference ability of sensors. Only by achieving deep collaboration between chips and systems through advanced packaging technology can performance requirements be met in complex scenarios. To achieve this goal, Dishan Technology has adopted innovative 3D stacking technology, which improves signal transmission efficiency and reduces power consumption through multi-level circuit design. In addition, in terms of thermal management, Dishan Technology has introduced advanced heat dissipation materials and structures to ensure that the chip can maintain stable performance even under high load operation. In terms of mechanical stability, the chip's shock resistance and durability have been enhanced by optimizing packaging materials and processes. These technological measures have enabled Dishan Technology to gain significant advantages in the field of intelligent automotive sensors.
Dishan Technology has focused on the following key technologies in the field of advanced packaging, building a comprehensive packaging solution system covering all scenarios:
The advanced packaging technology of Dishan Technology has been widely applied in multiple key fields and has become the core force driving industrial upgrading
Dishan Technology adheres to the development path of "technological independence and industrial chain collaboration", and promotes the localization process of advanced packaging technology:
