Amid the surging tide of the booming digital economy, visual perception technology is emerging as a bridge connecting the physical and digital worlds. As a critical cornerstone in this field, CMOS image sensors have been widely applied in key scenarios such as smartphones, autonomous driving, medical imaging, industrial inspection, and smart cities, serving as the core sensory component that enables artificial intelligence to "see" the world.
Dishan Technology, a leading domestic hub for the design and development of CMOS image sensors, is driving progress with technological innovation as its engine and industrial mission as its responsibility. Committed to breaking through core technological bottlenecks, the company strives to advance the independence and globalization of high-end domestic sensor chips, aiming to create a brighter future through the lens of technology.
In this domain brimming with opportunities and challenges, Dishan Technology is taking steady strides to write a brand-new chapter for China's semiconductor industry.
CMOS image sensors represent a typical technology-intensive industry, where their performance directly determines imaging quality, response speed, low-light performance, and power consumption levels. With the rapid development of markets such as smartphones, autonomous driving, and surveillance, the demand for high-performance CMOS image sensors is growing steadily. However, for a long time, the high-end sensor market has been dominated by foreign enterprises, and core technologies have been subject to external control. This has forced domestic companies to confront the dual challenges of technological supply disruptions and market competition.
Since its establishment, Dishan Technology has consistently adhered to the development path of "independent R&D and secure controllability." It has built a high-caliber R&D team led by senior semiconductor experts, whose members hail from top global semiconductor enterprises and research institutions, with an average of over 15 years of industry experience. Dishan Technology has achieved multiple breakthroughs in key technological areas including pixel structure design, Back-Side Illumination (BSI) technology, stacked architecture, and low-noise readout circuits. For instance, the independently developed "Dual Conversion Gain Pixel Technology" has significantly enhanced the sensor’s dynamic range, enabling imaging performance in both high-light and low-light environments that reaches internationally leading standards.
The company has established a full-chain R&D system covering everything from pixel design and circuit simulation to packaging and testing. This system emphasizes modular design and efficient process management, reducing the development cycle of new products by 30%. In addition, the company has invested hundreds of millions of yuan to build China’s first fully independent and controllable full-process sensor verification platform. Equipped with advanced automated testing equipment and an intelligent data analysis system, the platform has greatly improved the accuracy and efficiency of product testing.
Strategic cooperation with leading domestic wafer fabs not only ensures supply chain security but also continuously optimizes production processes and enhances product performance through joint R&D projects. Currently, the company has successfully mass-produced a variety of independently designed sensor chips, covering a complete product line from megapixel to 100-megapixel levels, which are widely used in security surveillance, machine vision, consumer electronics, and other fields. Among them, a specific sensor chip for high-end security surveillance can achieve clear imaging even under extremely low illumination. Its performance indicators surpass those of international counterparts, and its market share is continuously rising.
The achievement of these results has not only broken the foreign technological monopoly but also provided solid support for domestic substitution. This has enabled China to realize a historic leap from a "follower" to a "front-runner" in the field of high-end CMOS image sensors.
Innovation is in Dishan Technology’s DNA. Faced with the emerging trend of convergent development between AI and the Internet of Things (IoT), the company continuously pushes the frontiers of CMOS sensor applications. By integrating AI preprocessing capabilities, Dishan Technology has developed image sensors with "edge intelligence" that feature a built-in convolutional neural network (CNN) acceleration module. These sensors can complete real-time image capture and preliminary analysis directly on the chip, reducing system latency to the millisecond level and cutting bandwidth pressure by over 70%.
For example, in smart transportation scenarios, the sensors can locally perform tasks such as vehicle recognition, pedestrian detection, and traffic violation capture, only uploading critical structured data. This significantly enhances the efficiency of urban traffic management. The technology has been deployed in multiple smart city projects across China, providing robust support for the construction of intelligent transportation systems. According to feedback from the transportation department of a pilot city, after installing Dishan Technology’s image sensors, the traffic violation detection rate increased by 30% and the accident response time was reduced by 50%, greatly improving the effectiveness of traffic management.
Meanwhile, Dishan Technology is actively expanding into emerging fields, with sustained investment in event-driven vision sensors (Event Cameras), near-infrared and short-wave infrared imaging, and 3D stacked sensors. The company’s Dynamic Vision Sensor (DVS) can real-time detect motion changes in scenes with power consumption only one-tenth that of traditional frame-based sensors, demonstrating enormous potential in autonomous driving, industrial robotics, and other sectors. In the field of medical endoscopy, Dishan’s short-wave infrared imaging sensor can penetrate superficial tissues for imaging, offering more precise visual assistance for minimally invasive surgeries.
In addition, the company collaborates with universities and research institutions to explore new materials (such as organic photodetectors) and heterogeneous integration technologies. It has successfully developed a prototype of an ultrasensitive sensor based on graphene, laying the technological groundwork for next-generation sensors. Breakthroughs in these cutting-edge technologies have not only expanded the application scenarios of sensors but also redefined the boundaries of "perception."
Ecosystem Synergy: Forging an Open and Win-Win Industrial Landscape
As a technological hub, Dishan Technology not only focuses on the chips themselves but also places great emphasis on building an open and collaborative industrial ecosystem. The company has established in-depth partnerships with domestic wafer fabs and packaging and testing enterprises to jointly develop sensor manufacturing solutions tailored to homegrown processes. Through hundreds of process iterations, it has increased the yield rate of sensors on domestic 12-inch wafer production lines to over 95%. It has also collaborated with algorithm providers and system integrators to optimize the integrated "sensor + algorithm" solutions. For instance, the "Intelligent Security All-in-One Device" co-developed with a leading AI algorithm enterprise deeply integrates sensors with AI algorithms, boosting the target recognition accuracy to 99.8% and establishing itself as an industry benchmark product.
Looking ahead, Dishan Technology will continue to uphold its philosophy of "Driven by Innovation, Committed to Responsibility." It will deepen its expertise in the core technologies of CMOS image sensors and further break through key technical bottlenecks such as ultra-high resolution, ultra-low power consumption, and full-spectrum sensing. The company will increase R&D investment in emerging fields including automotive imaging, brain-computer interfaces, and the metaverse, promoting the in-depth integration of sensors with cutting-edge technologies such as AI, 5G, and quantum computing. Meanwhile, through global expansion, Dishan Technology plans to establish a research and development center in Europe to attract top international talent, accelerating technological iteration and market expansion. We firmly believe that through sustained technological breakthroughs and industrial collaboration, domestic sensors will surely shine on the global stage, contributing the power of "Chinese Chips" to building a smart world and forging a brighter future.
On the journey where light and shadow intersect, Dishan Technology is seeing and defining the future with its eyes of innovation. From the laboratory to the production line, from city streets to the vast starry sky, every Dishan chip embodies the warmth of technology, and every technological breakthrough writes a new chapter for the industry. Let us all look forward to Dishan Technology using "chips" as its brush to paint a brilliant picture of the digital economy era!