Disan Technology Supplies to German AragF Tech: Image Sensor Chips Shine on the International Industrial Stage

AragF Technologies GmbH was founded in 1996 and is headquartered in Munich, Germany. It is a leading supplier of industrial machine vision solutions in Europe. The company focuses on providing automated detection, positioning, and identification systems for high-end manufacturing, with customers covering industries such as automotive, electronics, medical equipment, and new energy. With innovative algorithms and excellent product performance, AragF has always led the forefront of industrial vision technology and is an important technical supporter of Germany's "Industry 4.0" strategy. Against the backdrop of rapid development in global intelligent manufacturing and industrial automation, the independent controllability and technological collaboration of core components have become particularly important. According to statistics, the global image sensor market has continued to grow in the past few years. In recent years, Chinese companies have been increasing their research and development investment in this field, striving to occupy a place in the global market. As a leading image sensor chip enterprise in China, Dishan Technology has supplied high-performance image sensor chips in bulk to AragF Technology, a well-known industrial vision solution provider in Germany. This marks the successful entry of domestically produced high-end sensor chips into the European high-end industrial market, taking a crucial step towards international strategic layout. This cooperation not only showcases the technological breakthroughs in China's semiconductor industry, but also reflects the deep cooperation between China and Germany in the field of intelligent manufacturing, injecting new impetus into the global industrial intelligence upgrade.

Strong alliance: technological integration achieves strategic cooperation As a pioneering enterprise in the field of industrial vision in Germany, AragF Technology has long focused on the research and innovation of industrial machine vision systems. Its products are widely used in high-precision and high demand fields such as automotive manufacturing, precision electronics, and new energy batteries. Faced with higher standards for visual systems in the Industry 4.0 era - higher resolution, faster processing speed, and stronger environmental adaptability - AragF has put forward almost stringent requirements for the performance of image sensors. German manufacturing is renowned for its rigor, and AragF places particular emphasis on technological leadership, product stability, and supply chain reliability when selecting partners. After a year long technical evaluation and multiple rounds of rigorous testing and verification, AragF ultimately chose to reach a supply cooperation agreement with Dishan Technology. Through multiple in-depth exchanges between the technical teams of both parties, it was discovered that Dishan Technology's technological accumulation in the field of CMOS image sensors, especially in breakthroughs in global shutter, high dynamic range, low-noise design, and industrial grade reliability, fully meets AragF's strict requirements for the next generation of visual systems. Dishan Technology not only provides chips that meet performance parameters, but also demonstrates the ability to quickly respond to customer needs and collaboratively develop customized solutions, which has become an important cornerstone of cooperation between the two parties.

Core product: DS-IND7000 series industrial grade image sensor chip The core product of this supply is the DS-IND7000 series image sensor chip independently developed by Dishan Technology, specially designed for high-end industrial application scenarios. Its core features have achieved technological breakthroughs in multiple dimensions: Combining ultra-high frame rate and resolution: Supports 200fps@4K The ultimate performance of resolution can meet the real-time detection needs of high-speed production lines and present clear images of subtle defects, providing a "sharp eye" for precision manufacturing; Global shutter technology: completely eliminates the "jelly effect" or "distortion" caused by traditional rolling shutter when shooting high-speed moving objects, ensuring the authenticity of images, especially suitable for scenes such as automotive stamping and robotic arm positioning; Wide dynamic range (WDR): It can still capture image details clearly in extreme lighting environments such as strong light, backlight, and alternating brightness. For example, in a lithium battery production workshop, it can not only see the reflective areas on the metal surface clearly, but also identify small defects in the dark; Multispectral response capability: Supports visible light and near-infrared imaging, greatly improving material defect recognition ability. For example, in semiconductor wafer inspection, near-infrared imaging can penetrate surface coatings and detect internal cracks; Industrial grade reliability: Through IEC 61508 functional safety certification, the working temperature range covers extreme industrial environments from -40 ° C to+85 ° C, and has strong electromagnetic interference resistance, ensuring stable operation in high interference scenarios such as automotive welding workshops and wind power equipment testing; Open ecosystem support: Provides complete SDK development toolkits, drivers, and reference designs, significantly reducing the threshold for customer secondary development and helping industrial vision systems integrate and land quickly. The chip has been successfully integrated into multiple core products of AragF, such as the DS-IND7000 model used in vehicle weld seam detection systems, as well as other customized versions in wafer appearance inspection equipment and intelligent logistics sorting systems. In practical applications, its excellent performance not only improves detection accuracy, but also helps customers optimize production line processes, achieving cost reduction and efficiency improvement. For example, in a well-known international semiconductor packaging factory, the detection equipment equipped with DS-IND7000 chip has increased the efficiency of wafer defect recognition by 2.3 times, and the AI recognition accuracy has reached 99.7%, helping customers achieve their "zero defect" production goals.

Collaboration achievements and customer value: Technology empowers industrial upgrading Since the introduction of DiShan Technology chips, AragF has achieved significant breakthroughs in multiple core businesses: In the field of automobile manufacturing: On the production line of a luxury car manufacturer in Germany, the DS-IND7000 welding seam detection system has improved the detection accuracy to 0.02mm, reduced the false detection rate by 60%, and significantly reduced the cost of manual re inspection. The production manager of the manufacturer stated, 'DS-IND7000 not only improves our testing efficiency, but also helps us achieve the' quality benchmark ', which is a one-time pass rate of over 99% for our products.'. ”The implementation of this standard is thanks to the continuous innovation and optimization of Dishan Technology in the field of image sensor chips. Semiconductor industry: The improvement of wafer inspection efficiency has shortened the production cycle, and the AI recognition accuracy is as high as 99.7%, helping customers cope with the challenge of "nanometer level accuracy" in chip manufacturing; Intelligent logistics scenario: The high-speed sorting system achieves a "double improvement" in package classification speed and accuracy through real-time image processing, promoting smart logistics towards higher efficiency; Comprehensive benefits: The overall system maintenance cost of the customer has been reduced by 15%, the product delivery cycle has been shortened by 20%, and its competitiveness in the global market has been enhanced. Dr. Heinrich, Chief Technology Officer of AragF Technology Company M ü ller highly praised the results of the collaboration: "The chips from Dishan Technology not only have excellent performance, but their technical support and collaborative development capabilities are also impressive. We look forward to establishing a long-term strategic partnership with Dishan Technology to jointly push the innovation boundaries of industrial vision technology. This cross continental collaboration has shown us the future possibilities of intelligent manufacturing

Strategic significance: a milestone for domestic chips to go global This supply is not only a victory for commercial cooperation, but also a landmark event for China's semiconductor industry chain to move towards high-end and internationalization, with multiple strategic significance: Breaking the monopoly of foreign technology: For a long time, the high-end industrial image sensor market has been dominated by international giants such as Sony and Anson. The breakthrough of Dishan Technology provides Chinese enterprises with high-performance and cost-effective "Chinese solutions", promoting the process of domestic substitution; Technology going global and value chain climbing: Through deep cooperation with leading European companies, Chinese chip companies are transforming from "technology followers" to "innovation leaders" and occupying a more advantageous position in the global value chain; Building a global collaborative ecosystem: The "Intelligent Vision Joint Laboratory" jointly established by both parties will become an incubator for technological innovation, and in the future, they will jointly explore cutting-edge directions such as AI+vision, 3D imaging, and edge intelligence to promote industry technological revolution; Empowering intelligent manufacturing upgrade: The international application of domestically produced high-end sensors will accelerate the intelligent transformation of the global manufacturing industry and help promote the deep integration of "Chinese intelligent manufacturing" and "German Industry 4.0".

Future outlook: Leading the journey of globalization with innovation Facing the future, Dishan Technology has formulated a clear strategic plan: Continuous technological breakthroughs: We plan to launch a sensor product line with higher resolution (such as 8K), lower power consumption, and more intelligent integration in the next three years, and explore cutting-edge technologies such as quantum imaging and event triggered vision; Global market expansion: On the basis of consolidating the European market, accelerate the expansion of North America, Japan, South Korea, Southeast Asia and other regions, and build a supply chain system covering major manufacturing centers around the world; Deepen ecological cooperation: Establish joint research and development mechanisms with more internationally renowned enterprises, promote standard setting and patent sharing, and create a mutually beneficial and win-win industrial ecosystem; Scenario based solution: Transforming from a single chip supplier to a comprehensive solution provider of "chip+algorithm+system", providing one-stop visual perception services for industrial customers. We believe that true technological competitiveness comes from a deep understanding of the scenario and continuous innovation, "said the CEO of Dishan Technology." The cooperation with AragF is an important step for 'Chinese chips' to go global. In the future, we will continue to be customer-oriented and technology driven, allowing Chinese designed image sensors to illuminate every pair of 'eyes' in global intelligent manufacturing and contribute Chinese wisdom to the progress of human society. ” Hand in hand, see the future with wisdom. The cooperation between Dishan Technology and AragF Technology Company not only writes a new chapter in Sino German technological cooperation, but also proves to the world that China's semiconductor industry is moving towards the peak of the global value chain with solid steps. Chinese chip, global intelligent manufacturing. The collaboration between Dishan Technology and AragF is driving the progress of human industrial civilization through technological innovation, and jointly opening up infinite possibilities for intelligent manufacturing. In the future, Dishan Technology plans to further optimize the performance of image sensor chips through continuous technological research and development and global cooperation, bringing more breakthrough progress to the field of intelligent manufacturing and striving to become a leader in the industry.